Good wettability type MFJ series

Support low Ag alloy

Good wettability with low Ag alloy can help to reduce material cost.

Good wettability for both of 3% Ag and low Ag

●Wettability test for through hole pad

Reduce flux spattering

Select flux base material according to higher melting point of solder alloy.Less spattering can achieve high performance soldering.

Less spattering

●Spattering test with soldering robot

Reduce flux spattering

Collect spattered flux onto thermal paper.【Condition】
Iron temp:380℃
Feed speed:15mm/s
Feed length:5mm×200 shots

Good durability of wettability

Good solderbility can achieve higher productivity for various type parts

Good durability of wettability

●Comparison of solder bridge with line soldering

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7)
Flux type	JIS-A MIL-RMA
Flux contents (%)	3.0％、4.0％、6.0％
Halide contents	0.08％～0.14％
Copper plate corrosion test	No Corrosion
Copper mirror corrosion	No Corrosion
Insulation resistance（Ω）	More than 5.0×108Ω
Electrochemical migration	No Migration
Flux name	MFJ