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WATER-SOLUBLE FLUX

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WATER-SOLUBLE FLUX

Water-soluble flux products that help make soldering more efficient and reliable.

Item nameHalide contents(%)Cleaning after solderingFeatures
Flast A33.4NecessaryApplicable to materials difficult to solder.
With broad soldering temperature range of 130 to 450℃.
The spreading rate is 95% for cupper, 95% for brass,90% for nickel,88% for stainless steel, and 90% for steel.
Flast S0.0NecessaryEspecially for stainless steel,but applicable to copper,nickel and steel as well.
Capable of soldering at relatively low temperature(about 250℃).
Dissolves above 350℃,making soldering impossible.
Umit soldering temperature to below 300℃.
The spreading rate is 92% for copper,92% for brass,90% for nickel,90% for stainless steel, and 91% for steel.
Flast D0.36UnnecessaryFor terminating copper wire;non-corrosive.
To terminate wires,apply flux,then dip the wires in a 350~450℃ solder bath.
The spreading rate is 92% for copper
Flast DA0.18UnnecessaryEven more reliable product than D.Non-corrosive and for terminaling wires.
The spreading rate is 90% for copper.
Flast H32.0NecessaryCapable of high-strength soldering of stainless steel,zinc alloys,steel,nickel,brass,copper and other metal.
Applicable to stained glass as well if diluted with water.The spreadingrate is 96% for copper.
Flast I0.9UnnecessaryFor terminaling leads.Decomposed at soldering temperature but is non-corrosive.The spreading rate is 94% for copper.
Flast G1.3NecessaryHave high viscosity and can apply by brush.
Applicable to nickel,copper,iron and other metals.
The spreading rate is 90% for copper.
Flast IH20.78UnnecessaryFor electric light bulb bases(brass)

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