Less void halogen free standard compliant type 7510 series

Reduce void

Adding material which faciliated that the gas in the molten solder comes out, it may reduce the remaining of voids.

Reduce voids

●Comparison of voids after continuous printing

Stable void reduction

Halogen-free compliant

No intentional addition of chlorine(Cl) bromine(Br), which generate dioxins.Compliant with most of halogen-free standards

Halogen-free compliant

●Compliant situation of 7510 series

Standards	Compliant situation
JPCA-ES01	Compliant
IEC61249-2-21	Compliant
IPC4101B	Compliant
JEITA ET-7304A	Non compliant

Comply to major halogen-free standards

Advanced wettability

Higher heat resistance can reduce defect of non-wetting and non-melting

Good wettability

●Confirmation of wettability by reflow

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type	Halogen free
Halide contents	Less than 0.01％
Powder particle size（μm）	38～20(Type 4)
Flux contents（％）	11.5%
Deterioration（Pa・S）	180
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 1.0×108Ω
Electrochemical migration	No migration
Halogen contents（ppm）	Cl : Less than 50 Br : Less than 100
Flux name	7510