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kanokwan@askmthailand.co.th
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Suitable for LASER heat soldering.Achieve a good soldering quality, with avoiding satelite balls.
●Solder ball test by LASER heating
Few solder ball occurs by rapid heating in short time
Irradiation time:0.2 sec
Parts:1005R chip
No intentional addition of chlorine(Cl) and bromine(Br), which genelate dioxins.Compliant with most of halogen-free standards.
●Compliant situation of 8239 series
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non compliant |
Comply to major halogen-free standards
Enable to adopt brand-new process combined LASER and printer which can shorten the SMT processing time as reflow oven is not required.
●Viscosity test of continuous printing
Stable viscosity of continuous printing
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | 0.10%~0.14% |
| Powder particle size(μm) | 38~20(Type 4) |
| Flux contents(%) | 10.5% |
| Deterioration(Pa・S) | 230 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance(Ω) | More than 1.0×109Ω |
| Electrochemical migration | No migraiton |
| Halogen contents(ppm) | Cl : Less than 50 Br : Less than 100 |
| Flux name | 8239 |
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