Low melting point halogen free standard compliant type 7610 series

Applied with low melting point alloy

Special designed for SMT of heat-sensitive parts.Solution for non-heat resistant parts soldering.

Good wettability

●Good wettability at low temperature heating

Condition:Atmospheric
Component:1005 chip
Profile:See the right graph

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of 7610 series

Standards	Compliant situation
JPCA-ES01	Compliant
IEC61249-2-21	Compliant
IPC4101B	Compliant
JEITA ET-7304A	Non compliant

Comply to major halogen-free standards

Applicable for low temperature reflow

Good wettability at even 160℃.Prevents joint failure and enhances reliability.

Compliant for low temperature reflow

●Reflow profile example

Sufficient wettability at a peak temperature of 160℃

Alloy type	F7 (Sn:Bal / Bi 58)
Flux type	Halogen free
Halide contents	Less than 0.01%
Powder particle size（μm）	45～25(Type 3)
Flux contents（％）	9.5%
Deterioration（Pa・S）	200
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 1.0×108Ω
Electrochemical migration	No migration
Halogen contents（ppm）	Cl : Less than 50 Br : Less than 100
Flux name	7610