Less spattering type MYK series

Very few spattering

Select suitable flux base material for higher melting point alloy.Very few flux spattering can achieve high performance soldering.

Very few spattering

●Flux spattering test by using soldering iron robot

Can apply with LASER soldering with low Ag

Selected materials suitable for rapid light heating achieves high workability. Good wettability with low Ag alloy can help to reduce cost.

Can apply with LASER soldering with low Ag

●Confirmation of wettability with LASER soldering

【Condition】
Beam power:40W　Wire diameter:φ0.8mm
Preheat:0.05 　 　Wire feed:7mm/s,1.6s
Postheating:0.3s　 PCB:Cu,one side
Connector terminal:Brass,Sn plating on Ni

Tranparent flux residue

Good for after soldering appearance with transparent flux such as LED illumination.Can achiece higher productivity for outlook inspection.

Good outlook after soldering

●Put solder on white ceramic plate and heat with 270℃

Can achieve higher productivity for outlook inspection

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7)
Flux type	JIS-A MIL-RMA
Flux contents (%)	3.0％、4.0％、6.0％
Halide contents	0.08%～0.14%
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 5.0×108Ω
Electrochemical migration	No migration
Flux name	MYK