Non-cleaning type for stainless steel,nickel,brass ESK series

Solderable to stainless steel

Possible for robot soldering and hand soldering by iron, even for stainless steel parts which is difficult to solder.

Solderable to stainless steel

●Wettability test for stainless steel plate

Good solderability also in stainless steel【Condition】
Iron temp:380℃
Base material:SUS304

Strong wettability

Use a fluorine-based special activater. Strong activation force produces good workability for flame base material such as nickel and brass.

Good workability for flame base material

●Wettability test for Ni pad

Good wettability enabls to shorten working time.【Condition】
Iron temp:370℃
Pad:Ni,3mm■
Soldering time:2.5s/point

Non-clean

Suppress the corrosion to secure the reliability after solderig.Cleaning of flux residue is not required like the general flux cored solder wire.

Non-clean

●Copper plate corrosion test

Strong activity and low corrosivity stand side by side

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type	Fluorine type
Flux contents (%)	3.0％、4.0％、6.0％
Halide contents	0.1％～0.4％
Copper plate corrosion test	No corrosion
Insulation resistance（Ω）	More than 1.0×107Ω
Electrochemical migration	No migration
Fluorine contents（％）	0.2％～0.4％
Flux name	ESK