Water soluble type WSG series

Good wettability

Apply flux activator according to base material.Good solderbility can achieve higher productivity for various type parts.

Good wettability

●Wettability comparison in line soldering

Sustained wettability

• 【Condition】
• Iron temp:360℃Iron speed:5mm/s

Good water washability

Water soluble base material instead of rosin.The residue after soldering is possible to clean away easily with water.

Good water washability

●Ionic residue test

The flux residue is possible to clean with water

【Test method】JIS Z 3197 8.5.2【Condition】
Cleaning solution:Pure water
Washing temp:50℃
Washing time:1 min
Number of washings:3

Reduce spattering

With the effect of special activator, solder and flux spattering were reduced.Higher mounting quality can be secured.

Very few spattering

●Flux spattering test with soldering iron robot

Few spattering

• 
• Collect spattered flux onto thermal paper.【Condition】
  Iron temp:380℃
  Feed speed:15mm/s
  Feed length:5mm × 200 shots

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) J9 (Sn:Bal / Ag 3.5 / Cu 0.7)
Flux type	Water soluble type
Flux contents (%)	2.0％、3.0％
Halide contents	1.6％～2.4％
Copper plate corrosion test	No corrosion (after cleaning with water)
Copper mirror corrosion	No corrosion (after cleaning with water)
Insulation resistance（Ω）	More than 1.0×108Ω (after cleaning with water)
Electrochemical migration	No migration (after cleaning with water)
Flux name	WSG