Completely halogen free type HFC series

Good wettability

Adding a special activators other than Cl and Br. Good wettability while compliant to halogen-free standards.

Good wettability

●Soldering test with soldering robot

Equivalent wettability to Halogen-containing products

• 【Condition】
  Iron temp:400℃
  Iron speed:20mm/s
  PCB:Cu, one side

Completely halogen-free

No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with current all halogen-free standards.

Halogen-free compliant

●Compliant situation of HFC series

Standards	Compliant situation
JPCA-ES01	Compliant
IEC61249-2-21	Compliant
IPC4101B	Compliant
JEITA ET-7304A	Compliant

Comply to all of halogen free standards

Solderable to the flame base material

Good wettability even for nickel and brass.Can solder with various components.

Solderable to the flame base material

●Wettability test for base material plate

Solderable to various base material

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R3 (Sn:Bal / Cu 0.55)
Flux type	Halogen free type
Flux contents (%)	3.0％、4.0％、6.0％
Halide contents	less than 0.3%
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 1.0×109Ω
Electrochemical migration	No migration
Halogen contents（ppm）	Cl : Less than 50 Br : Less than100
Flux name	HFC