Flux cored solder wire list

Flux name	Alloy type	Flux type	Halide contents(%)	Characteristics
MFJ	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7)	JIS-A MIL-RMA	0.08％～0.14％	Good wettability type
MYK	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7)	JIS-A MIL-RMA	0.08%～0.14%	Less spattering type
ESK	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7)	Fluorine type	0.1％～0.4％	Non-cleaning type for stainless steel,nickel,brass
EHA	K4 (Sn:Bal / Ag 3.5 / Ni 0.2)	Fluorine type	less than 0.3％	Non-cleaning type for aluminum
DDL	J3 (Sn:Bal / Ag 3.0 / Cu 0.5)	JIS-AA	0.06％～0.10％	Residue crack preventing type
EYP	J3 (Sn:Bal / Ag 3.0 / Cu 0.5)	Halogen-free type	0.1%～0.6%	Good wettability H/F type (Iodine containing)
HFC	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R3 (Sn:Bal / Cu 0.55)	Halogen free type	less than 0.3%	Halogen-free (Completely halogen free)
WSG	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) J9 (Sn:Bal / Ag 3.5 / Cu 0.7)	Water soluble type	1.6％～2.4％	Water soluble type

◎ → Excellent 〇 → Good △ → Normal × → Not applicable

Form number	Wettability	Spattering	Residue crack preventing	Need to wash ?	soldering method	Compatible base material
Form number	Wettability	Spattering	Residue crack preventing	Need to wash ?	soldering method	Cu	S/S	Ni	Al
MFJ series	◎	〇	×	No	Iron	◎	×	〇	×
MYK series	〇	◎	△	No	Iron、LASER	◎	×	〇	×
ESK series	◎	△	×	No	Iron、LASER	◎	◎	◎	×
EHA series	◎	△	×	No	Iron	◎	〇	◎	◎
DDL series	〇	〇	◎	No	Iron、LASER	◎	×	〇	×
EYP series	◎	〇	×	No	Iron、LASER	◎	〇	〇	×
HFC series	〇	△	×	No	Iron	◎	×	△	×
WSG series	◎	△	－	Yes	Iron	◎	×	〇	×

Language