Good wettability type 1001 series

Advanced wettability

Higher heat resistance can reduce defect of non-wetting and non-melting

Good wettability

●High temperature preheating test

Good wettability in severe conditions
Condition:Atmospheric
Pre heat:200℃ 120 seconds
Component:0.4mm pitch QFP φ0.30mm dot

Good transportability

Prevent quality deterioration during transportation.

Good transportability

●35℃ deterioration test

Prevent quality deterioration during transportation

Long lasting stability

With new technology of controlling activator at room temperature, stable at long time printing and transportation.

Good stability on continuous printing

●Confirmation of the shape of the printed solder paste

Stable shape after long time printing
J3-1001-UG(3Ag)
0.4mm pitch QFP
Stencil thickness:0.12mm

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type	MIL-RMA
Halide contents	Less than 0.02%
Powder particle size（μm）	38～20(Type 4)
Flux contents（％）	12.0%
Deterioration（Pa・S）	190
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 5.0×108Ω
Electrochemical migration	No migration
Flux name	1001