Completely halogen free type 3700 series

Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
1608R chip
Beam power:30W

Completely halogen-free

No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with curent all halogen-free standards.

Halogen-free compliant

●Compliant situation of 3700 series

Standards	Compliant situation
JPCA-ES01	Compliant
IEC61249-2-21	Compliant
IPC4101B	Compliant
JEITA ET-7304A	Compliant

Comply to all of halogen free standards

Good dispensing stability

Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.

Good dispensing stability

●Continuous dispense test

Stable dispense volume

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type	Halogen free
Halide contents	0％
Powder particle size（μm）	45～25(Type 3) 38～20(Type 4)
Flux contents（％）	14.5%
Deterioration（Pa・S）	130
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 1.0×108Ω
Electrochemical migration	No migration
Halogen contents（ppm）	Cl : Less than 50 Br : Less than 100
Flux name	3700