Halogen free for micro components 3232 series

Reduce solder ball

Special activator enables rapid heating SMT by LASER. Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
1608R chip
Beam power:40W

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Comopliant situation of 3232 series

Standards	Compliant situation
JPCA-ES01	Compliant
IEC61249-2-21	Compliant
IPC4101B	Compliant
JEITA ET-7304A	Non compliant

Comply to major halogen-free standards

Specialize in the micro-parts soldering

Special designed for the soldering of micro-components,Solution for peculiar problems of micro-components.

Suitable for LASER heating of narrow pitch

●SMT test of QFP parts

Suitable for various SMT parts

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type	Halogen free
Halide contents	0.10%～0.14%
Powder particle size（μm）	25～15(Type 5)
Flux contents（％）	14.5%
Deterioration（Pa・S）	100
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	1.0×108Ω
Electrochemical migration	No migration
Halogen contents（ppm）	Cl : Less than 50 Br : Less than 100
Flux name	3232