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Prevent “Tombstone” phenomenon BT02B878C

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Prevent “Tombstone” phenomenon BT02B878C

Addition of Ag to eutectic alloy widen the melting point
which may prevent “Tombstone” phenomenon.
Enhance adhesive charactoristic of flux may prevent micro component moving after mounting.
Also addition of Ag can prevent Ag corrosion and can get more strong soldering joint.

Alloy typeSn62-Pb36-Ag2
Flux typeMIL-RMA
Halide contents(%)0.04%
Powder particle size(μm)45~25(Type3)
Flux contents(%)9.5%
Copper plate corrosionNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)more than 5.0×108Ω
Electrochemical migrationNo Migration
Flux name878

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