Mail Us For Support
kanokwan@askmthailand.co.th
Call us (Mon-Fri)
(+66) 093-225-8797
Office Address
Bang Phli, Samut Prakan
Addition of Ag to eutectic alloy widen the melting point
which may prevent “Tombstone” phenomenon.
Enhance adhesive charactoristic of flux may prevent micro component moving after mounting.
Also addition of Ag can prevent Ag corrosion and can get more strong soldering joint.
| Alloy type | Sn62-Pb36-Ag2 |
|---|---|
| Flux type | MIL-RMA |
| Halide contents(%) | 0.04% |
| Powder particle size(μm) | 45~25(Type3) |
| Flux contents(%) | 9.5% |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance(Ω) | more than 5.0×108Ω |
| Electrochemical migration | No Migration |
| Flux name | 878 |
Comments are closed