Easy wash type 8820 series

Good wettability

Special activators achieve the same wettability as regular non-crean solder paste.

Good wettability

●Confirm wettability during continuous printing

Good wettability continues even during long-term continuous printing
0.5mm QFP
Stencil thickness:0.15mm

Correspond to the washing process

Use material that is highly miscible with solvents for the flux base.Improves the washability of the residue.

Good washability

●Ionic residue test

After 1 min washing with IPA at 40℃, measure the amount of ions
Good washability in the ionic residue test

Long lasting printing stability

Prevents the reaction of the flux and powder, in order to prevent the viscosity increasement during continuous printing.Enable to implement stably.

Good stability on continuous printing

●Confimation of the shape of the printed solder paste

Stable shape after long time printing
0.5mm QFP
Stencil thickness:0.15mm

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type	MIL-RMA
Halide contents	Less than 0.007%
Powder particle size（μm）	38～25(Equivalent to type4)
Flux contents（％）	11.0%
Deterioration（Pa・S）	220
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 5.0×108Ω
Electrochemical migration	No migration
Flux name	8820