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Use fluorine-based special activator. Strong activation produce good workability for flame base material such as nickel and brass.
●Wettability test for nickel and brass.
【Condition】Hot plate temp:270℃
Suppress the corrosion to secure the reliability after soldering. Cleaning of flux residue is not required. Can you like usual flux cored solder wire.
●Copper plate corrosion test
Strong activity and low corrosivity stand side by side
Possible with robot soldering and hand soldering by iron, even for stainless steel parts, which is difficult to solder.
●Wettability test for stainless steel plate
| Alloy type | Sn45-Pb Sn50-Pb Sn60-Pb Sn63-Pb |
|---|---|
| Flux type | Fluorine type |
| Flux contents(%) | 3% |
| Halide contents(%) | 0.1%~0.4% |
| Copper plate corrosion | No corrosion |
| Insulation resistance(Ω) | more than 1.0×107Ω |
| Electrochemical migration | No migration |
| Flux name | STECHRON |
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