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Solder paste using high melting point alloy.
Suitable for components which has high temperature
such as power semiconductor.
Applying high viscosity flux may prevent solder balls
during reflow process.
| Alloy type | Sn5-Pb92.5-Ag2.5 |
|---|---|
| Flux type | RMA |
| Halide contents(%) | 0.10±0.04% |
| Powder particle size(μm) | 45~25µm |
| Flux contents(%) | 8.0±0.5、9.5±0.5% |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance(Ω) | more than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 8882 |
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