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Standard solder paste BH63B878C

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Standard solder paste BH63B878C

Non clean type solder paste with conventional reflow.
Due to slightly higher contents of rosin, this is not suitable
with ICT test method.

Alloy typeSn63-Pb37
Flux typeMIL-RMA
Halide contents(%)0.04%
Powder particle size(μm)45~25(Type3)
Flux contents(%)9.5%
Copper plate corrosionNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)more than 5.0×108Ω
Electrochemical migrationNo migration
Flux name878

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