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For micro components 3230 series

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For micro components 3230 series

Reduce solder ball

Special activator enables rapid heating SMT by LASER .Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating.
1608R chip
Beam power:40W

Specialize in the SMT of micro-components.

Special designed for the soldering of micro-components, Solution for peculiar problems of micro components.

Special designed for micro-components

EVASOL 3230 series is special designed for micro-components.Please use the 3229 series for large parts.

●Applicable example
  Smaller chip components than 1608
  Camera module of smartphone etc.

●Inapplicable example
  Through-hole parts, connectors

Good dispensing stability

Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.

Good dispensing stability

●Continuous dispense test

Stable dispense volume

Alloy typeJ3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux typeMIL-RMA
Halide contents0.08%~0.1%
Powder particle size(μm)38~20(Type 4)
Flux contents(%)14.5%
Deterioration(Pa・S)100
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 1.0×108Ω
Electrochemical migrationNo migration
Flux name3230

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